ESSENTIAL DUTIES AND RESPONSIBILITIES include the following. Other duties may be assigned. Establish appropriate procedures for process control. Monitor lab analysis for compliance and assure proper action is taken. Initiate and/or support development of new plating equipment and rack design, as well as the upgrading and automation of plating processes. This includes adaptations to customer design requirements. Prepare control plans and required documentation for plating process. Use analytical techniques, such as Atomic Absorption Spectophotometry, titrations, and surface analysis to understand process problems. Participate in Material Review Board (MRB) for plating issues. Interface with suppliers of equipment and plating solutions. Initiate and monitor cost reduction programs. Participate, with the plating team, in the implementation and maintenance of Statistical Process Control. Supports waste treatment and all other wet chemical processes throughout the plant. Assist in plating associate and lab operator training. Ensure the facility is in compliance with Company, Federal and State policies concerning handling of chemicals and waste materials.

PRINCIPLE WORKING RELATIONSHIPS: Works closely with the laboratory personnel, team leaders, wastewater pretreatment operators and the plating team to achieve department goals and to support departmental objectives. Cooperates and supports corporate and plant health and safety department in the performance of duties and responsibilities. Works closely with the plating team and engineering support team to ensure continuously improved plating product throughput and quality. Cooperates with human resources, purchasing, material planning, quality and other departments. Project priority is established by plant and product line needs.

EDUCATION and/or EXPERIENCE: Requires education generally equivalent to a bachelor`s degree from a four-year college or university, in chemistry, chemical engineering or related technical discipline. Five years of experience in an electroplating and/or electroless plating manufacturing setting and in basic laboratory analysis is preferred.